0.8mm typ. 6.4mm [0.252"] 9mm [0.354"] 8mm [0.315"] 0.8mm [0.031"] 0.9mm [0.035"] 4.55mm [0.179"] 0.36mm 0.05mm [0.014" 0.002"] 0.2mm dia. [0.008"] 7.2mm [0.283"] 0.46mm dia. [0.018"] status: released drawing: m.a. fedde scale: 6:1 rev: b date: 2/25/08 modified: 07/01/14 file: SF-BGA60C-B-61F dwg.mcd SF-BGA60C-B-61F drawing t o l e r a n c e s : diameters 0.03mm [0.001"], pcb perimeters 0.13m m [0.005"], pcb thicknesses 0.18mm [0.007"], pit ches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0 .005"] unless stated otherwise. materials and spec ifications are subject to change without notice. pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). substrate: 1.59mm 0.18mm [0.0625" 0.007"] fr4/g10 or equivalent high temp material; non-clad 2 1 1 2 top view side view d e s c r i p t i o n : giga-snap bga smt foot 60 position terminal pins (0.8mm centers, 8x10 arra y) to smt solder balls (bga type). pin asignment 1: 1. ? 2008 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com 3 solder balls: sn96.5ag3.0cu0.5 3
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